Your Design Phase: OEM Deployment

How PHYTEC Can Help

PHYTEC SOMs are optimized for OEM deployment.  Our hardware addresses the challenges presented by quality assurance, design and software requirements, as well as supply and product maintenance issues.

Quality Assurance, Conformance & Certification, Reliability & Test

PHYTEC's internal quality control program encompasses all material, labor and production inputs. Our qualifications and standards include:

  • ISO9001:2000
  • RoHS-compliance
  • IPC-600A-F class 2, 3 PCBs
  • IPC-610A-D class 2 assembly
  • J-STD-004 no-clean
  • CE conformance
  • VDA, KTA1401
  • MTBF analysis

All PHYTEC hardware is subjected to AOI (Automated Optical Inspection), as well as visual inspection, functional test and electrical test following assembly.  All units passing test receive a unique serial number.

Low EMI Design

The phyCORE's compact form factor, increased pin package and multi-layer design improves its EMI (Electromagnetic Interference) characteristics and allows insertion of these SOMs into an even wider spectrum of user target hardware environments, including high noise environments.  phyCORE modules achieve their small size through advanced SMD technology.  Use of 0402-packaged SMD, laser-drilled Microvias and µBGA components on these subassemblies provides you with access to this cutting edge miniaturization technology for integration into your target hardware.

Small board size means short signal traces, further minimizing EMI susceptibility. In addition, 20% of all pins on the phyCORE's external connectors are tied to ground (GND).  This addresses independent research indicating that approximately 70% of all EMI problems stem from insufficient supply voltage grounding.

The top and bottom signal-routing layers of the 6- to 12-layer phyCORE PCBs feature a by-pass capacitor grid in which 1nF and 100nF capacitors are arranged in a checkerboard fashion, thus quickly driving all interference and other impedance to GND to further minimize EMI.

Mix-Speed Design

phyCORE SOM subassemblies support increasingly complex high-speed processors in progressively smaller packaging.  These ICs share PCB space with a diversity of other circuits with varying clock speeds and supply voltages.  PHYTEC has used our two decades of board-level layout experience to meet the challenges of high and mixed circuit speeds within a very dense PCB design.

Selection of PCB base material and quartz crystals; optimal stackup for signal integrity, placement and grouping of components; as well as signal decoupling and routing topology across isolated PCB planes are among the foundations of our design integrity.  Our industrial board design has been verified by not only advanced layout and PCB simulation tools, but by high yields among our customer base in a wide range of OEM deployments.

Robust Interconnects

High-density 0.635 mm Molex SlimStack connectors are used to interface most phyCORE modules to target hardware.  These connectors offer advantages of numerous mating cycles, SMT tails that create strong solder fillets, a friction locking feature for added mating retention, as well as reliability under severe shock and vibration.  The high-pitch connector provides ample pins to tie 20% to GND.  Deploy these production-ready BSPs with our insert-ready SOMs.... and save time and money as well as reduce design risk in terms of both software and hardware development.

Industrial Temperature Range

In order to ensure deployment in a wide range of industrial applications, most phyCORE SOM subassemblies are available in an industrial temperature range (-40… +85°C).  Reduced cost commercial range configurations are also optionally available.

Production-ready BSPs & Drivers

Bundled Linux and Windows Embedded CE Board Support Packages (BSP) further provide immediate Out-of-Box support of, and drivers for, all essential hardware features.