Low EMI Design

The phyCORE's compact form factor, increased pin package and multi-layer design improves its EMI (Electromagnetic Interference) characteristics and allows insertion of these SOMs into an even wider spectrum of user target hardware environments, including high noise environments.  phyCORE modules achieve their small size through advanced SMD technology.  Use of 0402-packaged SMD, laser-drilled Microvias and µBGA components on these subassemblies provides you with access to this cutting edge miniaturization technology for integration into your target hardware.

Small board size means short signal traces, further minimizing EMI susceptibility. In addition, 20% of all pins on the phyCORE's external connectors are tied to ground (GND).  This addresses independent research indicating that approximately 70% of all EMI problems stem from insufficient supply voltage grounding.

The top and bottom signal-routing layers of the 6- to 12-layer phyCORE PCBs feature a by-pass capacitor grid in which 1nF and 100nF capacitors are arranged in a checkerboard fashion, thus quickly driving all interference and other impedance to GND to further minimize EMI.

 

Project consulting

Based on our knowledge and know-how we will be pleased to render advice and support that will help you implement your projects successfully.
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