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NEW
phyCORE®-AM62x
Arm®Cortex®-A53/-M4F
Particularly suitable for industrial HMI, robot control, medical devices or building automation.
- Single, dual or quad core cortex®-A53 (up to 1,4GHz)
- 1x isolated cortex®-M4F MCU (up to 400MHz) for general purpose, security and protection
- Dual display support with 24-bit RBG parallel interface and OLDI/LVDS 4-lane x2, up to 200 MHz pixel clock for 2K display resolution
- Selectable GPU support, up to 8 GFLOPS, for better graphics performance
- Camera interface (1x MIPI CSI-2 v1.3)
- With Samtec connector or as cost-optimized soldering module
- Programmable Realtime Unit (PRU) support
- Two Gigabit Ethernet interfaces (1x via PHY, 1x as RGMII)
- A variety of industrial interfaces (e.g. 8x UART, 4x SPI, 5x I2C, 2x USB 2.0, 3x CAN FD, 3x eMMC and SD, 3x McASP for audio) are available
- Dedicated central system controller for security, power and resource planning
- Support for multiple power saving modes (e.g.: deep sleep, standby, MCU only) enable battery powered applications
The phyCORE-AM62x module is the continuation of the phyCORE-AM335x family. The processor offers ultra-low power modes, dual display, multi-sensor edge computing, security and other BOM-saving integrations. The phyCORE module targets a wide range of applications such as industrial HMI, PLC/CNC/robot control, medical devices, building automation and more.
| Processor | TI AM623, TI AM625 |
| Core(s) | Single, dual or quad-core Arm® Cortex®-A53 |
| Additional core(s) | 1x Arm® Cortex®-M4F, 1x Arm® Cortex®-R5F (device mngmt.) |
| Clock frequency | up to 1.4 GHz (A53), up to 400 MHz (M4F) |
| L1 Cache | 32 kB D-cache, 32 kB I-cache per core |
| L2 cache | 512 kB with ECC |
| Internal RAM | shared 816 kB RAM with ECC |
| GPU | AXE-1-16 GPU - OpenGL ES 3.1, Vulkan 1.2 |
| Cryptographic acceleration | AES 128-256, SHA2 224-512, DRBG, PKA |
| HW security | Secure boot, Arm TrustZone®, ext. firewall, secure watchdog/timer/IPC/storage, dedicated security cntlr., etc. |
| Functional safety | Hardware integrity: SIL 2 targeted |
| Systematic capability: up to SIL 3 targeted |
| Size | 43 mm x 32 mm x 7.6 mm (plug-in modules) |
| 40.8 mm x 40.8 mm x 2.84 mm (solder module) | |
| Weight | approx. 9.1 g (plug-in modules), approx. 8.6 g (solder module) |
| Operating temperature | -40 ° C to + 85 ° C |
| Humidity | 95% RH non-condensing |
| Operating voltage | 5.0 V |
| Power consumption typ. | 1.47 W (in idle mode) |
| PCB connection | 2x 120 pin Samtec, 0.5 mm pitch or 270-Pin, 0.8 mm pitch solder con. (half hole) |
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