Interchangeable System on Modules:
PHYTEC introduces phyFLEX product line

Interchangeability without compromise

The phyFLEX System on Modules provide interchangeability without compromise and complement the connectorized and solder-down modules of the phyCORE series. The phyFLEX series is based on the pinout of the FPSC footprint, in which the signals are divided into three categories. Mandatory Signals are the same for all current and future modules in a feature set and achieve maximum compatibility. Optional Signals are supported by many processors with consideration for future SOMs of the FPSC feature set. Specialized Signals are not subject to standardization and can be used to utilize special processor features or increase customization of the system. Companies can use the signal categories to decide which level of functionality and pin compatibility best suits their projects and applications.

When using Mandatory and Optional Signals, which together account for over 80 percent of all signals, the modules can be replaced in the long term without any changes to the carrier board. This helps customers manage technology trends, component allocation and second sourcing in addition to product variants and upgrades. PHYTEC understands the importance of balancing standardization and customization.

Bodo Huber, CEO of PHYTEC, says about the new phyFLEX product line:

"Many customers have responded very positively to our concept of flexibly interchangeable modules. Some use the SOMs to offer different product variants with the same carrier board. Others rely on FPSC for future-proofing because they know they can stick with their design even with new processor generations. And a third group uses the SOMs because they are compact, price-optimized, and robust—without having to worry about upgrades or product variants right now. With the new phyFLEX product line, we want to further strengthen this concept of interchangeability without compromise."

Robust, optimized for production and cost-effective

All current phyFLEX SOMs use the FPSC footprint and FTGA (Fused Tin Grid Array) soldering technology. This enables high-strength solder joints, with retaining points providing mechanical coupling of the SOM to the carrier board. phyFLEX SOMs simplify development and are cost-optimized for series production.

Development support from BSP to security

PHYTEC offers comprehensive services for its phyCORE and phyFLEX System on Modules, from the development of customized hardware and software according to customer requirements to embedded imaging integration, security, and update and device management. This also includes supporting customers in meeting CRA, RED and other guideline requirements, even full-service CVE testing and lifecycle management for hardware and software.