Overview

phyCORE®-i.MX 8M

ARM CortexTM-A53/-M4F

The phyCORE-i.MX 8M System on Module is particularly suitable for multimedia, HMI and wireless communication applications. One special feature is the integrated Wi-Fi/BLE 4.2 module. When placing the processor, care was taken to place capacitors directly below the processor in order to achieve optimum signal and system stability. Since the phyCORE-i.MX 8M has been designed as a solder module FTGA (Fused Tin Grid Array), costs and resources are already saved during production. Additionally, an extremely flat profile of the entire product is possible. Separate, grounded soldering surfaces on the underside of the module allow for additional mounting, so that the phyCORE-i.MX 8M can also be used for devices in demanding and harsh environments.

Processor from NXP with up to 1.5 GHz and 3D-graphics acceleration: i.MX 8M

  • Quad CortexTM-A53 1.5 GHz, CortexTM M4F 400 MHz
  • GC7000L 3D GPU
  • 4k Ultra HD, HDR10, Dolby Vision

On-Board

  • Maximum 8 GB LPDDR4 RAM, up ot64 GB eMMC
  • 4 kB EEPROM and up to 64 MB QSPI NOR-Flash
  • PMIC, Gb Ethernet-PHY, RTC Wi-Fi/BLE 4.2 module

Entwicklungskits


i.MX 6

Sample Price: Info
185.00

Part Number:
KPB-02419-001





Weitere Informationen zu den Kits ».

Small compact dimensions

  • Size 55 mm x 40 mm x 5 mm
  • 501 solder contacts + 4 soldering corners
  • Fused Tin Grid Array (FTGA) with excellent vibration resistance

Development advantages

  • 3.3 V supply and optimized pinout for carrier board with low circuitry complexity
  • oldering module, therefore direct cost savings by saving the connectors
  • Optimal EMC characteristics due to more than 20 % GND contacts directly assigned to the individual signals
  • Ready adapted operating system
  • Extensive periphery
  • Support for D, A, CH, and Europe at the headquarters in Mainz

Security Features

PHYTEC modules support comprehensive security features in hardware and software. All functions supported by the i.MX 8M processor as well as further information about our security concept can be found here.

Technical Details

Features\Name phyCORE-i.MX 8M phyBOARD-Polaris Kit phyBOARD-Polaris Imaging Kit
Product Module Single Board Computer Single Board Computer
Processor i.MX 8MQuad/
i.MX 8MDual/
i.MX 8MQuadLite
i.MX 8M Quad i.MX 8M Quad
Architecture ARM Cortex-A53 /
-M4F
ARM Cortex-A53 /
-M4F
ARM Cortex-A53 /
-M4F
Bit width Architecture 64-bit, RAM bus connection 32-bit 32 bit 32 bit
Frequency up to 1.5 GHz 4x 1.3 GHz 4x 1.3 GHz
Graphics Vivante GC7000 Lite (4 shader, 25.6 GFLOPs 32-bit, 51.2 GFLOPs 16-bit) Vivante GC7000 Lite (4 shader, 25.6 GFLOPs 32-bit, 51.2 GFLOPs 16-bit) Vivante GC7000Light (4 shader, 25.6 GFLOPs)
Video 4k Ultra HD, HDR10, Dolby Vision 4k Ultra HD, HDR10 4k Ultra HD, HDR10
Crypto AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG
MEMORY
eMMC 4 GB - 64 GB 8 GB 8 GB
NOR Flash 4 MB - 64 MB - -
LPDDR4 RAM 512 MB - 8 GB 1 GB 2 GB
EEPROM 4 kB 4 kB 4 kB
INTERFACES
Ethernet 1x 10/100/1000 Mbit/s, RGMII optional 1x 10/100/1000 Mbit/s 1x 10/100/1000 Mbit/s
WiFi 802.11 b/g/n (ac)
2.4 GHz / 5 GHz
802.11 b/g/n (ac)
2.4 GHz / 5 GHz
802.11 b/g/n (ac)
2.4 GHz / 5 GHz
Bluetooth BLE 4.2 BLE 4.2 BLE 4.2
USB 2x USB3.0 OTG 1x USB3.0 Host,
1x USB OTG
1x USB3.0 Host,
1x USB OTG
UART 4x 4x 4x
PCI / PCIe 2x PCIe 2.0 1x miniPCIe 1x miniPCIe
I²C 3x 3x 3x
SPI up to 3x ECSPI 2x ECSPI 2x ECSPI
QSPI 2x 2x 2x
MMC/SD/SDIO 1x SDIO microSD Card microSD Card
PWM up to 4x 3x 3x
LCD Interface 1 x MIPI DSI, 1 x HDMI 1x HDMI,
MIPI-DSI via AV-Connector
1x HDMI,
MIPI-DSI via AV-Connector
Audio up to 6x SAI, 1x SPDIF SAI via A/V Connector,
SPDIF via Expansion Connector
SAI via A/V Connector,
SPDIF via Expansion Connector
Camera Interface 2x MIPI CSI-2 2x phyCAM-M
(MIPI CSI-2)
2x phyCAM-M
(MIPI CSI-2)
Camera 2x MIPI CSI-2 2x MIPI CSI-2 1x HD color camera VM-016-COL-M12
Lens 1x 12mm,
M12 (S-Mount)
RTC Low power, high precision external RTC RTC with Lithium Coin Cell RTC with Lithium Coin Cell
Power Supply 3.3 V 12-24 V via Power Adapter 12-24 V via Power Adapter
Dimensions 60 mm x 40 mm 100 x 100 mm 100 x 100 mm
Connectors 501 solder pads,
1.27 mm pitch
Fused Tin Grid Array (FTGA)
501 solder pads,
1.27 mm pitch
Fused Tin Grid Array (FTGA)
501 solder pads,
1.27 mm pitch
Fused Tin Grid Array (FTGA)
Temperature range -40°C up to +85°C -40°C up to +85°C -40°C up to +85°C
SOFTWARE
Operating system Linux Linux Linux
Distribution Yocto Yocto Yocto
Debug Interface UART, JTAG UART UART
Kit Content phyBOARD-Polaris i.MX 8M, Quickstart Instructions, Linux Yocto BSP phyBOARD-Polaris i.MX 8M, Quickstart Instructions, Linux Yocto BSP, HD Camera VM-016-COL-M12 incl. 12 mm lens, Camera cable

Pricing plus VAT

Module Alpha Kit Embedded Imaging Kit
Price on request
Quote
€ 185,00
Quote
€ 279,00
Quote


Accessories:




10,1'' LVDS Display, MIPI to LVDS Converter, Cable
€ 210,00
Quote
€ 210,00
Quote


Download

See here for the phyCORE-i.MX 8M Download » section.

i.MX 8 Contact

Please use our contact form and get in touch with PHYTEC Germany to receive more information about the i.MX 8 product family and discuss your project with us. 

See here for our Contact Form.