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1 Mission
Simplifying processor upgrades and securing investments – that is our mission for your business success with phyFLEX and FPSC.
3 signal categories
FSPC modules classify signals into three categories, allowing their pinout to be assigned in a flexible yet standardized manner – saving development time and costs.
100% Future Proof
FPSC product series are extra future-proof. The pin-compatible modules of a feature set enable product variants and future upgrades without loss of functionality.
phyFLEX –
The future-proof embedded platform for sustainable success
In a fast-moving technology industry, one thing matters above all: investments that have a long-term impact.
With phyFLEX modules in the FPSC solder module standard, PHYTEC offers an embedded solution that stabilizes and accelerates your development processes.
- Uniform FPSC Standard for maximum reusability and investment security
- Durable platform for stable hardware and software integration across product generations
- Minimized development risk through standardized interfaces and proven architecture
- Fast market access through easy integration into existing and new designs
With phyFLEX modules, you secure your technological advantage – today and in the future.
Overview of Advantages
Uniform standard – variable features and performance
- FPSC offers scalability for the processing power of the processor as well as for the evolution of features without redesigning the end device
- The device design can include price and equipment variants
- The processor decides on the range of functions – the pinout remains the same
FTGA soldering technology for highest quality and reliability
- Particularly stable board-to-board solder connections
- Double-sided solder reservoirs minimize the risk of faulty solder joints
- Minimal coplanarity deviations
- Extreme stress and vibration resistance (EN 60068-2 series of standards)
- Particularly high production yield
Size-optimized, cost-optimized, flexible and robust
- Flexibility through variable sizes
- Cost-optimized without costs for power strips
- The integration of new interfaces and future processor innovations becomes possible
- Flexibility through variable sizes
- Stable anchor solder connections in the corners
Minimal complexity in Basisplatinen-Routing
- Those who use FPSC modules can save up to 70% on the base board
- 6 layers Basisplatinen-Design is sufficient
- Drilled via technology
- 100µm line and space: 2 signal lines between 2 pads
- Optimized signal integrity of differential signals
With FPSC modules, price savings of up to 50-70% for the PCB are possible!
Simplified development through 3 signal categories
phyFLEX modules have guaranteed Mandatory Signals for highest
Compatibility. The FPSC standard also takes into account that
Processor families differ in their main focus. This forms FPSC in
so-called subclasses of the must-have signals: For example, Vision, HMI
and industrial networking. This should facilitate the selection of the appropriate phyFLEX
Simplify the module for specific applications.
In addition to Mandatroy Signals, there is the category of Optional SignalsHere, signals are routed to pins that are currently supported by many processors and will also be considered for future System on Modules of the FPSC feature set.
The third level enables the use of processor features that are not subject to standardization and are therefore unique to a processor. This also allows the use of special and new processor features.
The gray areas show the X-shaped solder connection for maximum hold.
Choose your System on Module according to application area
The mandatory signals of the FPSC standard are divided into subclasses.
This makes it easier to select suitable FPSC SOMs for applications such as image processing, HMI or industrial networks.
Subclass 1 = Vision | Guaranteed feature MIPI CSI-2 interface
Subclass 2 = HMI | Guaranteed feature LVDS display interface
Subclass 3 = Industrial networking | Guaranteed feature CAN(FD) and RGMII
The pinout of phyFLEX modules in the Gamma feature set
According to the FPSC standard, no fixed PCB sizes or module aspect ratios are defined for phyFLEX modules in the Gamma feature set. However, there are three different size recommendations for the footprint design.
Size S: The smallest SoM footprint, suitable for modules with medium
and low performanceSize M: This footprint was specifically designed for high-performance modules
It can also accommodate S-size modules, but not
Modules of size LSize L: The largest available footprint offers the greatest flexibility as it
can accommodate all available module sizes. This format is
particularly “future-proof” as it allows easy upgrades to more powerful
Modules enable
The Gamma feature set has typical interfaces such as Ethernet, USB, PCIe, GPIO as mandatory signals, which are required for the development of most Products are already completely sufficient.
All modules with the same feature set are pin compatible and interchangeable.
